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Complementary metal oxide semiconductor (CMOS) image sensors operate at lower voltages than CCDs, reducing power consumption for portable applications. Analog and digital processing functions can be integrated readily onto the CMOS chip, reducing system package size and overall cost. Search by Specification | Learn More
Complementary metal oxide semiconductor (CMOS) cameras use image sensors that operate at lower voltages than charged coupled devices (CCDs), reducing power consumption for portable applications. Each CMOS active pixel sensor cell has its own buffer amplifier, and can be addressed and read individually. Search by Specification | Learn More
Packaging machinery is used to package products or components, including equipment that forms, fills, seals, wraps, cleans and packages at different levels of automation. Search by Specification | Learn More
IC package converters and adapters are electronic interconnect devices that are used to interface different types of integrated circuit (IC) sockets. Search by Specification | Learn More
Packaging equipment design and packaging equipment fabrication services specialize in the design and fabrication of packaging equipment and packaging products. Learn More
Packaging tapes and films are used to seal or wrap boxes, bottles or other packages. Search by Specification | Learn More
Contract packaging services package and/or label products and materials produced by other companies on a contract basis. Search by Specification | Learn More
Packaging design service providers utilize design experience, industry knowledge and technology in the creation of consumer and industrial packaging containers, shipping fixtures and packing supplies. Learn More
Electronic packaging and integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices. Learn More
Flexible packaging conforms to the size and shape of the packaged item. Search by Specification | Learn More
Specialty packaging and labeling equipment and supplies are specialized or proprietary machines, products and accessories for packaging and labeling applications. Learn More
Protective packaging is packaging that is designed and constructed of materials to protect the goods from atmospheric, magnetic, electrostatic, vibration or shock damage. There are many different types of protective packaging including air pillows, angle or edge board, bubble wrap or foam packaging, partition, corrugated wrapping, cradle, foam-in-place, packaging insert, packing peanuts, panels, trays, and void fillers. Search by Specification | Learn More
Packaging containers are used within the packaging process to store and ship products. They differ in terms of features and applications. Most packaging containers are made of paper, plastic, metal, wood or composite materials. Search by Specification | Learn More
...image. They typically employ color separation devices such as beamsplitters rather than having integral filters on the sensors. Choices for imaging technologies for video cameras include CCD, CMOS, tube, and film. Charge Coupled Devices (CCD) use... Search by Specification | Learn More
Form, fill and seal machines are packaging equipment that uses flexible, heat-sealable, plastic film to form packages that can be filled with a product and then sealed, and cut. Search by Specification | Learn More
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High Performance Imaging Breakthrough Fairchild Imaging
CMOS 1421 Linear Sensor Fairchild Imaging
CMOS linear image sensor, S9226/S9227 Hamamatsu Corporation USA
Breakthrough in CMOS Image Sensor Technology Fairchild Imaging
Fiber-optic coupled camera - largest available CCD Fairchild Imaging
CCD 21241 High Speed TDI Sensor Fairchild Imaging
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The ACPL-W70L (single-channel) is 15 MBd CMOS optocouplers in Stretched SO6 package. The optocouplers utilize the latest CMOS IC technology to achieve outstanding performance with very low power consumption. Basic building blocks of ACPL-W70L are high speed LEDs and CMOS detector ICs. (read more)
Side-by-side LDO regulator stages are engaged depending on load requirements-- 20 µA, max power consumption in high-speed mode, 2 µA, max in power-save mode; features include operation from input as low as 1.7 V; integrated output discharge function; inrush current, over-temperature and over-current protection. (read more)
ROHM formally introduces its complete line of Hall Effect ICs for portable electronics applications. An important feature of the product family is its availability in the industry's smallest chip-scale BGA package, measuring just 1.1 mm square with a package height of just 0.5 mm. A slightly larger surface-mount package, measuring 1.6 x 1.6 x 0.6 mm, is also available. (read more)
ROHM's BHxxMA3W series are highly efficient, high performance CMOS LDO regulators with extremely low dropout voltage and high ripple rejection ratio that provide high performance and low power consumption for portable applications/designs. (read more)
The newest edition to ROHM's CMOS LDO regulator lineup is the ultra-compact BHxxRB1WGUT series featuring an output current of 150mA, high output voltage accuracy (±1%), a low drop out voltage of 100mV (at Io=100mA), and consumption currents of 34µA and 0µA during operation and standby, respectively. (read more)
ROHM LDO regulators utilize an advanced CMOS process and circuit technology for low current and power consumption. The devices are available in a range of package types, including compact chip scale products ideal for high density mounting. (read more)
Genie HM camera models deliver high speed image acquisition and uncomprimised signal-to-noise ratio, for increased yield. DALSA's proprietary image sensor technology allows for image capture rates of 300 fps in VGA resolution while maintaining exceptional image quality. (read more)
Founded in 1978 in a custom built facility in the heart of the Silicon Valley, our Class 10 Environment facility contains fabrication and production as well as design engineering and testing capability which is focused on providing solutions for wide ranging customer applications in a most reliable and cost effective manner using the most modern and safe practices. (read more)
PixeLINK is a manufacturer of high-performance color and monochrome CMOS cameras designed for machine vision and industrial inspection applications. PixeLINK's CMOS cameras are available in three configurations and can be customized for OEM applications. (read more)
The CMOS 1421 device features Active Reset™ CMOS technology providing low noise and high sensitivity. The architecture is a 2048 element linear array with 7 µm pixels. (read more)
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| COP8SAC744V8 | Amazon | American Microsemiconductor | Industrial & Scientific | COP8SAC744V8 |
| ADG779BKS-REEL7 | Newark | ANALOG DEVICES | Analog Multiplexers | Multiplexer IC; Package/Case:6-SC70; Packaging:Cut Tape; Function:CMOS Analog Multiplexer/Switch; Mounting Type:Surface Mount |
| CD4520BM96 | Newark | TEXAS INSTRUMENTS | Counters/Multipliers/Dividers | Counter Logic IC; Logic Family:CD4000; Package/Case:16-SOIC; No. of Pins:16; Operating Temperature Range:-55?C to +125?C; Input Type:CMOS; Leaded Process Compatible:Yes; Output Type:CMOS; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes |
| CD74HC4017QM96Q1 | Newark | TEXAS INSTRUMENTS | Counters/Multipliers/Dividers | Counter Logic IC; Logic Family:HC; Package/Case:16-SOIC; No. of Pins:16; Operating Temperature Range:-40?C to +125?C; Input Type:CMOS; Output Type:CMOS; Supply Voltage Max:6V; Supply Voltage Min:2V |
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Technology Backgrounder : FUJITSU United States High-Performance / Low-Power 65nm CMOS Technology CS200 / CS200A Global Packaging Leadership 8 IP Portfolio |
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Fujitsu to Feature Industry-Leading Process Technology,... Fujitsu to Feature Industry-Leading Process Technology, Packaging Services in Booth 535 at Annual Fabless Semiconductor Association Conference See Fujitsu Limited Information |
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Untitled Packaging Quality Home Reference Designs LPV521 - Nanopower, 1.8V, RRIO, CMOS Input, Operational Amplifier |
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Untitled LPV521 - Nanopower, 1.8V, RRIO, CMOS Input, Operational Amplifier Quality / Packaging / Export RoHS / Green Compliance |
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Product Folder - FOD0708 - 15MBaud CMOS logic optocoupler.... Packaging Information Cross Reference Search Packaging Top Mark Search Obsolete Product Search See Fairchild Semiconductor Corporation Information |
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Fairchild low voltage logic, Fairchild Semiconductor - Global... Packaging Information Cross Reference Search Packaging Top Mark Search Obsolete Product Search See Fairchild Semiconductor Corporation Information |
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[No Title] See Newport Corporation Information |
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Package requirements for high performance VLSI CMOS chips |
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Reliability and thermal structure design for CMOS image sensor The design rules for thermal optimization of CMOS image sensor are summarized Conference Abstract: The following topics are dealt with: |
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Google Directory -... 0.18 and 0.25 micron CMOS and mixed signal CMOS IC. See Google, Inc. Information |